Henkel Loctite® ECCOBOND FP4450HF Epoxy

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Henkel Loctite® ECCOBOND FP4450HF Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat Cure Product Benefits: High purity Low stress Good moisture resistance Exhibits relatively high flow High temperature performance Excellent chemical resistance Application: Encapsulant Typical Package Application: Automotive applications BGA IC memory cards Chip carriers Hybrid circuits Chip-on-board Multi-chip modules Pin grid arrays LOCTITE ECCOBOND FP4450 encapsulant is designed for protection of bare semiconductor devices. It offers pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.79 g/cc
Filler Content	73 %
Particle Size	<= 25 µm
Brookfield Viscosity	32000 cP	Spindle 6, speed 20 rpm

Thermal Properties	Original Value	Comments
CTE, linear	21.0 µm/m-°C @Temperature 40.0 - 120 °C	Cured, Below Tg
	72.0 µm/m-°C @Temperature 190 - 220 °C	Cured, Above Tg
Thermal Conductivity	0.620 W/m-K @Temperature 100 °C	Cured
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-65.0 °C
Glass Transition Temp, Tg	164 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 110 °C	plus 3 hours @ 165°C, Alternative Cure Schedule
	30.0 min @Temperature 125 °C
	90.0 min @Temperature 165 °C
Pot Life	4.00 day	time to double viscosity
Gel Time	12.0 min @Temperature 121 °C
Shelf Life	9.00 Month @Temperature -40.0 °C	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	1	Cured, Sodium (Na+)
	1	Cured, Potassium (K+)
	2	Cured, Chloride (Cl-)

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PLOCT5078 / 255289

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