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Arlon Electronic Materials 85N Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: 85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

  • Low Z-expansion minimizes the risk of latent PTH defects caused during solder reflow and device attachment.
  • Up to 50% or more reduction in cure time compared with traditional polyimide cycles
  • Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
  • Toughened, Non-MDA chemistry resists drill cracking

Typical Applications:

  • PCBs that are subjected to high temperatures during processing, such as lead-free soldering
  • Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down-hole drilling, under-hood automotive controls, burn-in-boards, or industrial sensors

Information provided by ARLON Electronic Materials.

Available Properties
  • Water Absorption, IPC TM-650
  • Modulus of Elasticity, IPC TM-650
  • Poissons Ratio, ASTM D3039
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
  • Peel Strength, IPC TM-650, To Copper (1 oz./35 micron); At Elevated Temperatures
  • Volume Resistivity, IPC TM-650, C96/35/90
  • Volume Resistivity, IPC TM-650, E24/125
  • Surface Resistance, IPC TM-650, C96/35/90
  • Surface Resistance, IPC TM-650, E24/125
  • Dielectric Constant, IPC TM-650, May vary with resin %
  • Dielectric Strength, IPC TM-650
  • Dissipation Factor, IPC TM-650
  • Arc Resistance, IPC TM-650 2.5.1
  • CTE, linear, IPC TM-650 2.4.41
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
  • Thermal Conductivity, ASTM E1461
  • Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
  • Decomposition Temperature, IPC TM-650 2.3.41, Onset
  • Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
  • Flammability, UL94
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