85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.- Low Z-expansion minimizes the risk of latent PTH defects caused during solder reflow and device attachment.
- Up to 50% or more reduction in cure time compared with traditional polyimide cycles
- Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
- Toughened, Non-MDA chemistry resists drill cracking
Typical Applications: - PCBs that are subjected to high temperatures during processing, such as lead-free soldering
- Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down-hole drilling, under-hood automotive controls, burn-in-boards, or industrial sensors
Information provided by ARLON Electronic Materials. |
