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Master Bond adhesives
Brewer Science BrewerBOND® 305 Temporary Bonding Material
Categories: Other Engineering Material

Material Notes: BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment. This product improves throughput, simplifies cleaning, and shortens processing time.

BrewerBOND® 305 material is an organic temporary bonding material that improves throughput, simplifies cleaning, and shortens processing time. The material is stable in back-end-of-line processing up to 300°C (depending on downstream process specifications). Debonding is efficient and can be done in two ways. The first method is laser debonding with no force. The second method is mechanical debonding at room temperature with low force. This debonding versatility makes BrewerBOND® 305 material a great option for many different wafer-processing needs.

Market sectors include 3-D wafer-level packaging; MEMS; and Compound semiconductor.

Benefits:

  • Enables backside temperature processing at 250°C - 300°C
  • Enables mechanical or laser debonding with low force
  • Maximizes wafer yield with optimized temporary wafer bonding with mechanical or laser debonding process
  • Post-bond TTV < 2 µm
  • Reduced cleaning chemical consumption and time

Information provided by Brewer Science.

Vendors:
Available Properties
  • Viscosity, Complex Melt Viscosity
  • Viscosity, Complex Melt Viscosity
  • Viscosity, Complex Melt Viscosity
  • Viscosity, Complex Melt Viscosity
  • Brookfield Viscosity, BrewerBOND® 305-30
  • Brookfield Viscosity, BrewerBOND® 305-30
  • Brookfield Viscosity, BrewerBOND® 305
  • Brookfield Viscosity, BrewerBOND® 305
  • Thickness, BrewerBOND® 305-30; Spin Speed 1700 rpm
  • Thickness, BrewerBOND® 305; Spin Speed 1700 rpm
  • Thickness, BrewerBOND® 305-30; Spin Speed 900 rpm
  • Thickness, BrewerBOND® 305; Spin Speed 900 rpm
  
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