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Master Bond adhesives
Henkel Loctite® ABLESTIK 8006NS Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: White

Product Benefits:

  • B-Stageable
  • Non-conductive
  • Offers improved printability
  • Engineered to accurately control bondline thickness and die tilt
Cure: Heat cure

Application: Die attach

Filler Type: Alumina/Silica

LOCTITE ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt.

Information provided by Loctite®

Vendors:
Available Properties
  • Brookfield Viscosity, Uncured, CP51, Speed 5 rpm
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Volume Resistivity
  • Dielectric Strength
  • Thermal Conductivity, Cured
  • Cure Time, Alternate Cure Schedule
  • Cure Time
  • Working Life
  • Shelf Life, Uncured, from date of manufacture
  
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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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