Henkel Loctite® ABLESTIK 8006NS Epoxy

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Henkel Loctite® ABLESTIK 8006NS Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: White Product Benefits: B-Stageable Non-conductive Offers improved printability Engineered to accurately control bondline thickness and die tilt Cure: Heat cure Application: Die attach Filler Type: Alumina/Silica LOCTITE ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	55000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	69.7 MPa @Temperature 250 °C	Cured, DMTA
	1196 MPa @Temperature 150 °C	Cured, DMTA
	4376 MPa @Temperature 25.0 °C	Cured, DMTA
	5908 MPa @Temperature -65.0 °C	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	4.30e+13 ohm-cm
Dielectric Strength	28.7 kV/mm

Thermal Properties	Original Value	Comments
Thermal Conductivity	0.440 W/m-K	Cured

Processing Properties	Original Value	Comments
Cure Time	0.500 hour @Temperature 175 °C	Alternate Cure Schedule
	2.00 hour @Temperature 160 °C
Working Life	>= 24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
	<15	Cured, Chloride (Cl-)
Shear Strength	23 kg-f	Die, 2 x 2 mm Si die on ceramic @ 245ºC
Thixotropic Index	1.3	Uncured, 0.5/5 rpm

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PLOCT5022 / 255233

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