Product Highlights:- Superior thermal conductivity
- Tremendous flexibility and elongation
- Cryogenic service
- Soaring peel strength
- Exceptional electrical insulation properties
- Capable of passing NASA low outgassing
Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight. It offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most flexible epoxies. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive service temperature range of 4K (-269.15°C) to +120°C. It fosters outstanding physical strength properties and yet consolidates high peel strength and elongation. KB 1031 AT-2LO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It offers excellent chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its excellent performance and vacuum compatibility KB 1031 AT-2LO is widely used in electronics and related industries. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
