Rogers Arlon CLTE-XT High Precision Ceramic PTFE

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Rogers Arlon CLTE-XT High Precision Ceramic PTFE
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	Microwave material for improved thermal management, Excellent dimensional stability with high degree of phase stability vs. temperature. CLTE-XT is a micro-dispersed ceramic PTFE composite utilizing a woven fiberglass reinforcement to provide the highest degree of stability, critical in multi-layer designs. Ceramic/PTFE microwave composite High thermal conductivity Lowest Insertion Loss in class Loss Tangent (0.0012) Tightest Dielectric constant and Thickness tolerance Electrical phase stability vs. temperature Benefits: Excellent thermal stability of Dk and Df Phase stability across temperature High degree of Dimensional stability required for complex, multi-layer boards Excellent CTE in X, Y and Z directions Typical Applications: Defense Microwave/RF Applications Radar Manifolds Phase Fed Array Antennas Microwave Feed Networks CNI (communication, navigation and identification) Applications SIGINT, Satellite and Space Electronics Phase Sensitive Electronic Applications Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss, NASA SP-R-0022A, Water Vapor Recovered
Outgassing - Total Mass Loss, NASA SP-R-0022A
Collected Volatile Condensable Material, NASA SP-R-0022A
Tensile Strength, IPC TM-650 2.4.18.3, Cross
Tensile Strength, IPC TM-650 2.4.18.3, Machine
Modulus of Elasticity, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4, Cross
Flexural Strength, IPC TM-650 2.4.4, Machine
Compressive Modulus, ASTM D3410
Poissons Ratio, ASTM D3039
Shear Modulus, Calculated
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Dielectric Constant, IPC TM-650 2.5.5.5, varies by thickness
Dielectric Constant, IPC TM-650 2.5.5.3, may vary by thickness
Dielectric Strength, IPC TM-650 2.5.6.2
Dielectric Breakdown, IPC TM-650 2.5.6
Dissipation Factor
Dissipation Factor
Dissipation Factor, IPC TM-650 2.5.5.3
Dissipation Factor, IPC TM-650 2.5.5.5
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
Thermal Conductivity, ASTM E1461
Decomposition Temperature, IPC TM-650 2.4.24.6, Initial
Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
Flammability, UL94

Property Data

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Plastic

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