Park Aerospace Nelco® N5000 BT Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N5000 BT Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco N5000 BT epoxy laminate and prepreg system provides superior electrical properties. The N5000 resin system wasoriginally developed for application specific use in high densitymilitary and commercial boards requiring not only close thicknesstolerance, but also the ability to withstand the stress of multiple soldering excursions and repeated chemical exposure. Key Features and Benefits: BT resin chemistry Excellent Reliability and Performance CAF Resistant Wide processing latitude Applications/Qualifications: Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers MCM-Ls Direct Chip Attach Wireless Communications High Density Interconnects RoHS Compliant Meets IPC-4101/30 Specifications Information provided by Park Electrochemical Corp.
Key Words:	EP
Vendors:

Available Properties

Density, 50% Resin Content; Internal Method
Water Absorption, IPC-TM-650.2.6.2.1
Modulus of Elasticity, ASTM D3039, Y
Modulus of Elasticity, ASTM D3039, X
Poissons Ratio, ASTM D3039, Y
Poissons Ratio, ASTM D3039, X
Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
Peel Strength, IPC-TM-650.2.4.8, after solder float
Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
Dielectric Constant, Split Post Cavity
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
Dielectric Strength, IPC-TM-650.2.5.6.2
Dielectric Breakdown, IPC-TM-650.2.5.6
Dissipation Factor, IPC-TM-650.2.5.5.5, Split Post Cavity
Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
Dissipation Factor, Stripline
Arc Resistance, IPC-TM-650.2.5.1
CTE, linear, IPC-TM-650.2.4.41, X/Y
Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA (Tan d Peak)
Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
Flammability, UL94

Property Data

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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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