Park Aerospace Nelco® N5000 BT Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N5000 BT Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco N5000 BT epoxy laminate and prepreg system provides superior electrical properties. The N5000 resin system wasoriginally developed for application specific use in high densitymilitary and commercial boards requiring not only close thicknesstolerance, but also the ability to withstand the stress of multiple soldering excursions and repeated chemical exposure. Key Features and Benefits: BT resin chemistry Excellent Reliability and Performance CAF Resistant Wide processing latitude Applications/Qualifications: Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers MCM-Ls Direct Chip Attach Wireless Communications High Density Interconnects RoHS Compliant Meets IPC-4101/30 Specifications Information provided by Park Electrochemical Corp.
Key Words:	EP
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Physical Properties	Original Value	Comments

Density	1.77 g/cc	50% Resin Content; Internal Method
Water Absorption	<= 0.050 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Original Value	Comments
Modulus of Elasticity	4100 ksi	Y; ASTM D3039
	4700 ksi	X; ASTM D3039
Poissons Ratio	0.14	Y; ASTM D3039
	0.16	X; ASTM D3039
Peel Strength	8.30 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	8.90 pli	after solder float; IPC-TM-650.2.4.8
	9.40 pli	after exposure to process solutions; IPC-TM-650.2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm-cm	E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+12 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm	E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant	3.6 @Frequency 2.50e+9 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.6 @Frequency 1e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.6 @Frequency 1e+10 Hz	Split Post Cavity
	3.8 @Frequency 1e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength	1200 V/mil	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.010 @Frequency 1e+10 Hz	Split Post Cavity; IPC-TM-650.2.5.5.5
	0.014 @Frequency 2.50e+9 Hz	Stripline
	0.014 @Frequency 1e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
Arc Resistance	118 sec	IPC-TM-650.2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	5.56 - 7.78 µin/in-°F @Temperature -40.0 - 125 °C	X/Y; IPC-TM-650.2.4.41
Glass Transition Temp, Tg	175 °C	TMA; IPC-TM-650.2.4.24c
	185 °C	DSC; IPC-TM-650.2.4.25c
	220 °C	DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature	334 °C	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0

Descriptive Properties
Methylene Chloride Resistance (% Weight Change)	0.7	IPC-TM-650.2.3.4.3
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	12+	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	3.8	50ºC to 260ºC; IPC-TM-650.2.4.41

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