Rogers Corporation XT/duroid™ 8100 0.002" Woven Glass Reinforced Thermoplastic Circuit Material

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Rogers Corporation XT/duroid™ 8100 0.002" Woven Glass Reinforced Thermoplastic Circuit Material
Categories:	Polymer; Thermoplastic
Material Notes:	XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8100 circuit materials are excellent for high frequency/high speed applications. Both dielectric constant and dissipation factor are stable over a wide range of frequencies. XT/duroid 8100 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The XT/duroid products possess impressive chemical and radiation resistance. Features and Benefits: Stable dielectric constant and dissipation factor over a wide frequency range - High reliability and uniform electrical properties over frequency High maximum operating temperature - suitable for applications where high temperature stability is required Excellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environments Environmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity 1/2 oz. very low profile electrodeposited copper foil cladding Typical Applications: Flex-to-install applications Lightweight feed manifolds Semiconductor burn-in Conformal circuitry Oil and gas exploration Information provided by Rogers Corporation.
Vendors:

Available Properties

Moisture Absorption at Equilibrium, IPC-TM-650 2.6.2.1, D24/23
Moisture Absorption at Equilibrium, ASTM D570, D48/50
Thickness
Tensile Strength, ASTM D638, RT
Tensile Modulus, ASTM D638, RT
Peel Strength, IPC-TM-650 2.4.8, Copper
Dielectric Constant, IPC-TM-650 2.5.5.5.1, Z direction
Dielectric Constant, Differential Phase Length Method, Z direction
Dielectric Strength, IPC-TM-650 2.5.6.2, Z Direction
Dissipation Factor, IPC-TM-650 2.5.5.5.1, Z direction
CTE, linear, IPC-TM-650 2.1.41, X-Direction
CTE, linear, IPC-TM-650 2.1.41, Y-Direction
CTE, linear, IPC-TM-650 2.1.41, Z-Direction
Thermal Conductivity, ASTM C518
Maximum Service Temperature, Air, pending UL RTI
Glass Transition Temp, Tg, ASTM D3850, TMA
Flammability, UL94, pending

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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