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Rogers Corporation XT/duroid™ 8100 0.002" Woven Glass Reinforced Thermoplastic Circuit Material
Categories: Polymer; Thermoplastic

Material Notes: XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8100 circuit materials are excellent for high frequency/high speed applications. Both dielectric constant and dissipation factor are stable over a wide range of frequencies.
XT/duroid 8100 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The XT/duroid products possess impressive chemical and radiation resistance.

Features and Benefits:

  • Stable dielectric constant and dissipation factor over a wide frequency range - High reliability and uniform electrical properties over frequency
  • High maximum operating temperature - suitable for applications where high temperature stability is required
  • Excellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environments
  • Environmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity
  • 1/2 oz. very low profile electrodeposited copper foil cladding

Typical Applications:

  • Flex-to-install applications
  • Lightweight feed manifolds
  • Semiconductor burn-in
  • Conformal circuitry
  • Oil and gas exploration

Information provided by Rogers Corporation.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Moisture Absorption at Equilibrium 0.050 %D24/23; IPC-TM-650 2.6.2.1
 0.15 %D48/50; ASTM D570
Thickness 2.00 mil
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 216 MPaRT; ASTM D638
Tensile Modulus 1670 ksiRT; ASTM D638
Peel Strength 6.20 pliCopper; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 3.49 - 3.59
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
 3.54
@Frequency 8.00e+9 - 4.00e+10 Hz
Z direction; Differential Phase Length Method
Dielectric Strength 2580 V/milZ Direction; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0049
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 16.5 µm/m-°C
@Temperature 0.000 - 150 °C
X-Direction; IPC-TM-650 2.1.41
 18.0 µm/m-°C
@Temperature 0.000 - 150 °C
Y-Direction; IPC-TM-650 2.1.41
 57.0 µm/m-°C
@Temperature 0.000 - 150 °C
Z-Direction; IPC-TM-650 2.1.41
Thermal Conductivity 0.300 W/m-KASTM C518
Maximum Service Temperature, Air >= 210 °Cpending UL RTI
Glass Transition Temp, Tg 172 °CTMA; ASTM D3850
Flammability, UL94 V-0
@Thickness 0.0508 mm
pending
 
Descriptive Properties
Dimensional Stability0.03 mm/mX-MD; IPC-TM-650, 2.4.39A; 150°C bake
 0.037 mm/mY-CMD; IPC-TM-650, 2.4.39A; 150°C bake
T260pass
Thermal Coefficient of Dielectric Constant9 ppm/°CIPC-TM-650 2.5.5.5.1; -100°C to 250°C
Time to Delamination (T-288)pass

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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