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Master Bond adhesives

Rogers Corporation XT/duroid™ 8100 0.002" Woven Glass Reinforced Thermoplastic Circuit Material
Categories: Polymer; Thermoplastic

Material Notes: XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8100 circuit materials are excellent for high frequency/high speed applications. Both dielectric constant and dissipation factor are stable over a wide range of frequencies.
XT/duroid 8100 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The XT/duroid products possess impressive chemical and radiation resistance.

Features and Benefits:

  • Stable dielectric constant and dissipation factor over a wide frequency range - High reliability and uniform electrical properties over frequency
  • High maximum operating temperature - suitable for applications where high temperature stability is required
  • Excellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environments
  • Environmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity
  • 1/2 oz. very low profile electrodeposited copper foil cladding

Typical Applications:

  • Flex-to-install applications
  • Lightweight feed manifolds
  • Semiconductor burn-in
  • Conformal circuitry
  • Oil and gas exploration

Information provided by Rogers Corporation.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Moisture Absorption at Equilibrium 0.050 %0.050 %D24/23; IPC-TM-650 2.6.2.1
 0.15 %0.15 %D48/50; ASTM D570
Thickness 50.8 microns2.00 mil
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 216 MPa31300 psiRT; ASTM D638
Tensile Modulus 11.5 GPa1670 ksiRT; ASTM D638
Peel Strength 1.09 kN/m6.20 pliCopper; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant  3.49 - 3.59
@Frequency 1e+10 Hz
3.49 - 3.59
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
 3.54
@Frequency 8.00e+9 - 4.00e+10 Hz
3.54
@Frequency 8.00e+9 - 4.00e+10 Hz
Z direction; Differential Phase Length Method
Dielectric Strength 102 kV/mm2580 kV/inZ Direction; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0049
@Frequency 1e+10 Hz
0.0049
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.5 µm/m-°C
@Temperature 0.000 - 150 °C
9.17 µin/in-°F
@Temperature 32.0 - 302 °F
X-Direction; IPC-TM-650 2.1.41
 18.0 µm/m-°C
@Temperature 0.000 - 150 °C
10.0 µin/in-°F
@Temperature 32.0 - 302 °F
Y-Direction; IPC-TM-650 2.1.41
 57.0 µm/m-°C
@Temperature 0.000 - 150 °C
31.7 µin/in-°F
@Temperature 32.0 - 302 °F
Z-Direction; IPC-TM-650 2.1.41
Thermal Conductivity 0.300 W/m-K2.08 BTU-in/hr-ft²-°FASTM C518
Maximum Service Temperature, Air >= 210 °C>= 410 °Fpending UL RTI
Glass Transition Temp, Tg 172 °C342 °FTMA; ASTM D3850
Flammability, UL94 V-0
@Thickness 0.0508 mm
V-0
@Thickness 0.00200 in
pending
 
Descriptive Properties
Dimensional Stability0.03 mm/mX-MD; IPC-TM-650, 2.4.39A; 150°C bake
 0.037 mm/mY-CMD; IPC-TM-650, 2.4.39A; 150°C bake
T260pass
Thermal Coefficient of Dielectric Constant9 ppm/°CIPC-TM-650 2.5.5.5.1; -100°C to 250°C
Time to Delamination (T-288)pass

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