Epoxy Technology EPO-TEK® 345T Electrically and Thermally Insulating Epoxy

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USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Epoxy Technology EPO-TEK® 345T Electrically and Thermally Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Material Description: A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy and a more thixotropic version of EPO-TEK® 354. Complies with USP Class VI biocompatibility standards. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	1.12 g/cc	1.12 g/cc	Part A
	1.15 g/cc	1.15 g/cc	Part B
Particle Size	<= 20 µm	<= 20 µm
Viscosity	11000 - 20000 cP @Temperature 23.0 °C	11000 - 20000 cP @Temperature 73.4 °F	20 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	23 ppm	23 ppm
Ionic Impurities - K (Potassium)	3.0 ppm	3.0 ppm
Ionic Impurities - Cl (Chloride)	38 ppm	38 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85
Tensile Modulus	2.07 GPa	300 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm	>= 1.00e+13 ohm-cm
Dielectric Constant	3.46 @Frequency 1000 Hz	3.46 @Frequency 1000 Hz
Dissipation Factor	0.0080 @Frequency 1000 Hz	0.0080 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	51.0 µm/m-°C	28.3 µin/in-°F	Below Tg
	179 µm/m-°C	99.4 µin/in-°F	Above Tg
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 95.0 °C	>= 203 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	485 °C	905 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	10.0 min @Temperature 150 °C	0.167 hour @Temperature 302 °F	minimum
	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F	minimum
Pot Life	180 min	180 min
Shelf Life	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F

Compliance Properties	Metric	English	Comments
USP Class VI	Yes	Yes

Descriptive Properties
Color	Amber		Part B
	Tan		Part A
Consistency	Smooth, thixotropic paste
Ionic Impurities NH₄	62 ppm
Mix Ratio by Weight	10:1
Number of Components	Two
Thixotropic Index	3.27
Weight Loss	0.1%		200°C
	0.23%		250°C
	0.48%		300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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