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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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Epoxy Technology EPO-TEK® 345T Electrically and Thermally Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy and a more thixotropic version of EPO-TEK® 354. Complies with USP Class VI biocompatibility standards.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.12 g/ccPart A
 1.15 g/ccPart B
Particle Size <= 20 µm
Viscosity 11000 - 20000 cP
@Temperature 23.0 °C
20 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 23 ppm
Ionic Impurities - K (Potassium) 3.0 ppm
Ionic Impurities - Cl (Chloride) 38 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85
Tensile Modulus 300000 psiStorage
Shear Strength >= 2000 psiLap
 >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cm
Dielectric Constant 3.46
@Frequency 1000 Hz
Dissipation Factor 0.0080
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 51.0 µm/m-°CBelow Tg
 179 µm/m-°CAbove Tg
Maximum Service Temperature, Air 250 °CContinuous
 350 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 95.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 485 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 10.0 min
@Temperature 150 °C
minimum
 30.0 min
@Temperature 120 °C
minimum
Pot Life 180 min
Shelf Life 6.00 Month
@Temperature 25.0 °C
 
Compliance PropertiesOriginal ValueComments
USP Class VI Yes
 
Descriptive Properties
ColorAmberPart B
 TanPart A
ConsistencySmooth, thixotropic paste
Ionic Impurities NH462 ppm
Mix Ratio by Weight10:1
Number of ComponentsTwo
Thixotropic Index3.27
Weight Loss0.1%200°C
 0.23%250°C
 0.48%300°C

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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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