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Chemically Resistant adhesives

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Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.

Advantages & Application Notes:

  • Ease of use: smooth flowing paste allows for automated dispensing, stamping, brushing, or hand applications. In some cases, the low viscosity nature of the paste allows it to be sprayed onto targets.
  • Suggested applications include: EMI and Rf shielding, ITO interconnects in LCDs, low temperature cryogenic cooling.
  • Exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.
  • Hybrid / Micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.
  • Bright and shiny silver epoxy; provides a metallic-like layer after cure.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.950 g/ccPart B
 3.10 g/ccPart A
Particle Size <= 45 µm
Viscosity 800 - 1600 cP
@Temperature 23.0 °C
100 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 23 ppm
Ionic Impurities - K (Potassium) 31 ppm
Ionic Impurities - Cl (Chloride) 151 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 60
Tensile Modulus 519000 psiStorage
Shear Strength 1266 psiLap
 >= 1700 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.00050 ohm-cm
 <= 0.00070 ohm-cm25°C/40-60%RH/3 Day cure
 
Thermal PropertiesOriginal ValueComments
CTE, linear 48.0 µm/m-°CBelow Tg
 150 µm/m-°CAbove Tg
Thermal Conductivity 1.37 W/m-K
Maximum Service Temperature, Air 150 °CContinuous
 250 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 40.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 380 °CDegradation Temperature; TGA
 
Processing PropertiesOriginal ValueComments
Cure Time 3.00 hour
@Temperature 80.0 °C
Minimum Bond Line
 6.00 hour
@Temperature 60.0 °C
Minimum Bond Line
 15.0 min
@Temperature 150 °C
Minimum Bond Line
 72.0 hour
@Temperature 23.0 °C
Minimum Bond Line
Pot Life 240 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorClear/ColorlessPart B
 SilverPart A
ConsistencySmooth flowing paste
Ionic Impurities NH423 ppm
Mix Ratio by Weight10:1
Number of ComponentsTwo
Thixotropic Index2.1
Weight Loss0.7%200°C

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PPOXYT014 / 141052

Chemically Resistant adhesives

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