ITW Insulcast® INSULGEL 70 CC Epoxy Potting/Encapsulation Compound

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ITW Insulcast® INSULGEL 70 CC Epoxy Potting/Encapsulation Compound
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Insulcast® solutions are compounds designed for potting and encapsulating. NSULGEL 70 CC is an epoxy compound exhibiting low shrinkage and thermal shock resistance. By making use of an inherently flexible epoxy resin and special filler technology, INSULGEL 70 CC provides reduced shrinkage and low coefficient of thermal expansion. This results in decreased stress and improved adhesion to components. Several curing agents for INSULGEL 70 CC are offered to satisfy such diverse requirements as fast cure for small components, extended pot life for uses involving large mixed quantities, and a heat cure hardener for higher temperature requirements. Information provided by ITW Performance Polymers.
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Physical Properties	Original Value	Comments

Specific Gravity	0.950 g/cc	Uncured. Insulcure 11B
	0.980 g/cc	Uncured. Part B-1
	1.00 g/cc	Uncured. Insulcure 9
	1.53 g/cc	Uncured. Insulgel 70 CC
Viscosity	<= 20 cP	Part B-1; ASTM D2393
	55 cP	Insulcure 9; ASTM D2393
	700 cP	Insulcure 11B; ASTM D2393
	16000 cP	Insulgel 70 CC; ASTM D2393

Mechanical Properties	Original Value	Comments
Hardness, Shore D	43	Part B-1; ASTM D2240
	75	Insulcure 9; ASTM D2240
	80	Insulcure 11B; ASTM D2240
Tensile Strength	1900 psi	cured. Insulcure 9; ASTM D638
	1900 psi	cured. Part B-1; ASTM D638
	2500 psi	cured. Insulcure 11B; ASTM D638
Elongation at Break	20 %	cured. Insulcure 11B; ASTM D638
	30 %	cured. Insulcure 9; ASTM D638
	120 %	cured. Part B-1; ASTM D638

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+10 ohm-cm @Temperature 100 °C	Part B-1; ASTM D257
	1.00e+11 ohm-cm @Temperature 100 °C	Insulcure 9; ASTM D257
	7.00e+12 ohm-cm @Temperature 25.0 °C	Part B-1; ASTM D257
	1.00e+13 ohm-cm @Temperature 100 °C	Insulcure 11B; ASTM D257
	1.00e+14 ohm-cm @Temperature 25.0 °C	Insulcure 9; ASTM D257
	1.00e+15 ohm-cm @Temperature 25.0 °C	Insulcure 11B; ASTM D257
Dielectric Constant	3.9 @Frequency 1000 Hz	Part B-1; ASTM D150
	4.5 @Frequency 1000 Hz	Insulcure 11B; ASTM D150
	4.5 @Frequency 1000 Hz	Insulcure 9; ASTM D150
Dielectric Strength	400 V/mil	Insulcure 9; ASTM D149
	400 V/mil	Part B-1; ASTM D149
	425 V/mil	Insulcure 11B; ASTM D149
Dissipation Factor	0.080 @Frequency 1000 Hz	Part B-1; ASTM D150
	0.30 @Frequency 1000 Hz	Insulcure 9; ASTM D150
	0.38 @Frequency 1000 Hz	Insulcure 11B; ASTM D150

Thermal Properties	Original Value	Comments
CTE, linear	31.0 µm/m-°C	cured. Insulcure 9
	31.0 µm/m-°C	cured. Part B-1
	32.0 µm/m-°C	cured. Insulcure 11B
Thermal Conductivity	3.60 BTU-in/hr-ft²-°F	cured. Part B-1
	4.20 BTU-in/hr-ft²-°F	cured. Insulcure 11B
	4.30 BTU-in/hr-ft²-°F	cured. Insulcure 9
Maximum Service Temperature, Air	105 °C	Part B-1
	130 °C	Insulcure 9
	155 °C	Insulcure 11B

Processing Properties	Original Value	Comments
Cure Time	2.00 hour @Temperature 100 °C	Insulcure 11B, post cure 1 hr @ 150°C
	16.0 - 24.0 hour @Temperature 25.0 °C	Insulcure 9
	16.0 - 24.0 hour @Temperature 25.0 °C	Part B-1. Post cure 12 hrs @ 50°C
Pot Life	0.500 - 0.750 min @Temperature 25.0 °C	Insulcure 9. 100g
	2.00 - 2.50 min @Temperature 25.0 °C	Insulcure 11B. 100g
	8.00 - 10.0 min @Temperature 25.0 °C	Part B-1. 100 g
Shelf Life	12.0 Month	Insulcure 11B
	12.0 Month	Insulcure 9
	12.0 Month	Insulgel 70 CC
	12.0 Month	Part B-1

Descriptive Properties
Color	amber	Uncured. Part B-1
	amber	Uncured. Insulcure 9
	amber	Uncured. Insulcure 11B
	black	Uncured. Insulgel 70 CC
Mix Ratio by weight	100:3.5-4	Insulgel 70 CC:Insulcure 9
	100:5.5-6	Insulgel 70 CC:Insulcure 11B
	100:9-10	Insulgel 70 CC:Part B-1

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