Four Material Grades HBC and HBT are the highest purity hot-pressed boron nitrides commercially available. They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up, and low loss tangent which makes them ideal for electronic applications. Grade HBT, although lower in strength and density than HBC, is available in larger sizes, at lower cost, and usually with a shorter delivery schedule. Grade HBN uses small amounts of boric oxide as a binder and should be used in applications where hydration and thermal shock are not a concern. Grade HBR uses calcium borate as a binder and is less sensitive to moisture.

Thermal Management The unique combination of being both an excellent electrical insulator and thermal conductor makes BN very useful as a heat sink in high power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, yet is easier to form and finish.

High Temperature Applications Temperature stability and excellent resistance to thermal shock makes BN the material of choice in the toughest high temperature applications such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.

Molten Metal HandlingBN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make useful in various molten metal processes.

Information provided by Momentive Performance Materials, formerly GE Advanced Ceramics.