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Master Bond adhesives

Copper, UNS C41900, H02 Temper strip
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Applications: electrical connectors

Test specimen: strip.

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Physical PropertiesMetricEnglishComments
Density 8.80 g/cc0.318 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell B 7373
Tensile Strength, Ultimate 470 MPa68200 psi
Tensile Strength, Yield 395 MPa
@Strain 0.2 %
57300 psi
@Strain 0.2 %
Elongation at Break 14 %14 %In 50 mm
Modulus of Elasticity 125 GPa18100 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000780 ohm-cm
@Temperature 20.0 °C
0.00000780 ohm-cm
@Temperature 68.0 °F
 
Thermal PropertiesMetricEnglishComments
CTE, linear 18.7 µm/m-°C
@Temperature 20.0 - 300 °C
10.4 µin/in-°F
@Temperature 68.0 - 572 °F
Thermal Conductivity 100 W/m-K
@Temperature 20.0 °C
694 BTU-in/hr-ft²-°F
@Temperature 68.0 °F
Melting Point 1000 - 1025 °C1830 - 1877 °F
Solidus 1000 °C1830 °F
Liquidus 1025 °C1877 °F
 
Processing PropertiesMetricEnglishComments
Annealing Temperature 480 - 680 °C896 - 1260 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 89 - 92 %89 - 92 %
Iron, Fe <= 0.050 %<= 0.050 %
Lead, Pb <= 0.10 %<= 0.10 %
Tin, Sn 4.8 - 5.5 %4.8 - 5.5 %
Zinc, Zn 4.35 %4.35 %

References for this datasheet.

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