Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener Filled version of RN-1200 with lower shrinkage, improved thermal properties and lower coefficient of expansion.
- Mix Ratio, Resin/Hardener (by weight): 100/14
Cure Type: Room Temperature Information provided by Cytec, subsequently acquired by Elantas. |