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Elmet Technologies

Elantas Conap RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic Applications
High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.

Cytec (Conap) RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener
Filled version of RN-1200 with lower shrinkage, improved thermal properties and lower coefficient of expansion.
  • Mix Ratio, Resin/Hardener (by weight): 100/14
Cure Type: Room Temperature

Information provided by Cytec, subsequently acquired by Elantas.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Viscosity 9000 cP
@Temperature 25.0 °C		9000 cP
@Temperature 77.0 °F
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 3.00e+13 ohm-cm<= 3.00e+13 ohm-cm
Dielectric Constant 4.9
@Frequency 1000 Hz		4.9
@Frequency 1000 Hz
Dielectric Strength 14.8 kV/mm375 kV/in
Dissipation Factor 0.0060
@Frequency 1000 Hz		0.0060
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 130 °C266 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 1440 min
@Temperature 25.0 °C		24.0 hour
@Temperature 77.0 °F
Pot Life 40.0 min
@Temperature 25.0 °C		40.0 min
@Temperature 77.0 °F		100 grams

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PCYTEC43 / 29275




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