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Master Bond adhesives

Copper-Bismuth Alloy, UNS C89535 , M01 Temper, As Sand Cast
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: As Sand Cast

Fabrication Properties: Excellent Suitability– Soldering; Fair Suitability – Brazing; Poor Suitability – Capacity for Being Cold Worked, Capacity for Being Hot Formed

Typical uses: Cu based devices for lead-free water applications; Lead-free defined as Calif. AB 1953 max. .25% lead content; Lead-free, dezincification resistant for potable water components; valves, fittings, pumps, meters

Applicable Specifications: As Sand Cast – Valves ASTM B763/B763M, ASTM B584; Ingot – ASTM B30

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Physical PropertiesMetricEnglishComments
Density 8.89 g/cc0.321 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell B >= 52>= 52
Tensile Strength 262 MPa38000 psiTypical
 221 - 305 MPa32000 - 44300 psi
Tensile Strength, Yield 110 - 152 MPa16000 - 22000 psi0.2% Offset
 131 MPa19000 psi0.2% Offset, Typical
Elongation at Break >= 15 %>= 15 %
Tensile Modulus 97.70 GPa14170 ksi
Modulus of Rigidity 35.2 GPa5110 ksi
Compressive Yield Strength >= 1600 MPa>= 232000 psi
Poissons Ratio 0.360.36
Fatigue Strength >= 89.6 MPa
@# of Cycles 1.00e+8
>= 13000 psi
@# of Cycles 1.00e+8
Machinability 75 %75 %
Shear Strength >= 207 MPa>= 30000 psi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000102 ohm-cm0.0000102 ohm-cm16.9% IACS
Magnetic Permeability 1.01.0
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.9 µm/m-°C
@Temperature 20.0 - 100 °C
9.40 µin/in-°F
@Temperature 68.0 - 212 °F
 17.5 µm/m-°C
@Temperature 20.0 - 200 °C
9.70 µin/in-°F
@Temperature 68.0 - 392 °F
 17.8 µm/m-°C
@Temperature 20.0 - 300 °C
9.90 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.377 J/g-°C0.0900 BTU/lb-°F
Thermal Conductivity 5.85 W/m-K40.6 BTU-in/hr-ft²-°F
Melting Point 800.0 - 1030 °C1472 - 1886 °F
Solidus 800.0 °C1472 °F
Liquidus 1030 °C1886 °F
 
Component Elements PropertiesMetricEnglishComments
Aluminum, Al <= 0.010 %<= 0.010 %
Antimony, Sb <= 0.20 %<= 0.20 %
Bismuth, Bi 0.80 - 2.0 %0.80 - 2.0 %
Copper, Cu 84 - 89 %84 - 89 %
Iron, Fe <= 0.30 %<= 0.30 %
Lead, Pb <= 0.25 %<= 0.25 %
Nickel, Ni 0.30 - 1.0 %0.30 - 1.0 %
Phosphorus, P <= 0.40 %<= 0.40 %
Selenium, Se <= 0.50 %<= 0.50 %
Silicon, Si <= 0.010 %<= 0.010 %
Tin, Sn 2.5 - 5.5 %2.5 - 5.5 %
Zinc, Zn 5.0 - 9.0 %5.0 - 9.0 %

References for this datasheet.

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MC89535x1 / 292579

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