Tosoh NP Semiconductor high-purity grade, Fused Silica Glass

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Tosoh NP Semiconductor high-purity grade, Fused Silica Glass
Categories:	Ceramic; Glass
Material Notes:	Tosoh N and NP materials are manufactured by fusing a high-purity silica powder using Tosoh's proprietary oxy-hydrogen flame fusion process. Thanks to its high purity, low aluminum content, and extremely low level of bubbles and inclusions, N has become the reference material for a broad range of applications, such as semiconductor manufacturing, metrology, optics, chemical processing, UV and high temperature windows. In particular, N is an enabling material for stringent plasma etch processes used in leading-edge semiconductor manufacturing. NP is an enhanced version of N material, with further reduced alkali content for use in processes that require extreme contamination control. Available in up to 1,200mm square and 580 mm round ingots, N and NP materials are 450mm wafer ready. Information provided by Tosh Corporation
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Density	2.20 g/cc	0.0795 lb/in³
Viscosity	12700 cP @Temperature 1200 °C	12700 cP @Temperature 2190 °F

Mechanical Properties	Metric	English	Comments
Hardness, Vickers	907.5	907.5
Tensile Strength	50.0 MPa	7250 psi
Modulus of Elasticity	74.0 GPa	10700 ksi	Young's
Flexural Strength	65.0 - 95.0 MPa	9430 - 13800 psi
Compressive Strength	1.13 MPa	164 psi
Poissons Ratio	0.17	0.17
Shear Modulus	31.0 GPa	4500 ksi
Torsional Stiffness	29.0 MPa	4210 psi

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.00e+16 ohm-cm	5.00e+16 ohm-cm
Surface Resistance	3.00e+15 ohm	3.00e+15 ohm
Dielectric Constant	3.9 @Frequency 5.00e+8 Hz	3.9 @Frequency 5.00e+8 Hz
Dielectric Strength	32.0 kV/mm @Frequency 50 Hz	813 kV/in @Frequency 50 Hz
Dielectric Loss Index	<= 1.0 @Frequency 5.00e+8 Hz	<= 1.0 @Frequency 5.00e+8 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	0.570 µm/m-°C @Temperature 30.0 - 600 °C	0.317 µin/in-°F @Temperature 86.0 - 1110 °F
Specific Heat Capacity	0.749 J/g-°C	0.179 BTU/lb-°F
Thermal Conductivity	1.38 W/m-K	9.58 BTU-in/hr-ft²-°F
Softening Point	1720 °C	3130 °F	(?=107.6)*2
Annealing Point	1180 °C	2160 °F	(?=1013)
Strain Point	1080 °C	1980 °F	(?=1014.5)

Descriptive Properties
Chemical Properties	? 0.01ppm		Cu
	0.04 ppm		Mg
	0.05 ppm		K
	0.05 ppm		Li
	0.12 ppm		Fe
	0.14 ppm		Na
	0.6 ppm		Ca
	270 ppm		OH
	8.1 ppm		Al

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PTOSOH007 / 306465

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message