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Chemically Resistant adhesives

Rogers Corporation TMM® TMM6 Ceramic Thermoset Polymer Composite
Categories: Polymer; Thermoset

Material Notes: TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.

Features:

  • Wide range of dielectric constants. Ideal for single material systems on a wide variety of applications.
  • Excellent mechanical properties. Resists creep and cold flow.
  • Exceptionally low thermal coefficient of dielectric constant.
  • Coefficient of thermal expansion matched to copper. High reliability of plated through holes.
  • Resistant to process chemicals. No damage to material during fabrication and assembly processes.
  • Thermoset resin for reliable wirebonding. No specialized production techniques required. TMM 10 and 10i laminates can replace alumina substrates.
  • Lead-free process compatible

Typical Applications:

  • RF and Microwave Circuitry
  • Global Positioning Systems Antennas
  • Power Amplifiers and Combiners
  • Patch Antennas
  • Filters and Coupler
  • Dielectric Polarizers and Lenses
  • Satellite Communication Systems
  • Chip Testers

Information provided by Rogers Corporation.

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Physical PropertiesMetricEnglishComments
Specific Gravity 2.37 g/cc2.37 g/ccASTM D792
Water Absorption  0.060 %
@Thickness 1.27 mm
0.060 %
@Thickness 0.0500 in
D/48/50; ASTM D570
 0.20 %
@Thickness 3.17 mm
0.20 %
@Thickness 0.125 in
D/48/50; ASTM D570
Thickness 381 - 12700 microns15.0 - 500 milRange of Standard Thicknesses
 
Mechanical PropertiesMetricEnglishComments
Flexural Strength 104 MPa15100 psiX, Y direction; Condition A; ASTM D790
Flexural Modulus 12.1 GPa1750 ksiX, Y direction; Condition A; ASTM D790
Izod Impact, Notched 0.224 J/cm0.420 ft-lb/inX, Y direction; ASTM D256A
Peel Strength 0.999 kN/m5.70 pliX, Y direction; after solder float 1 oz. EDC; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+14 ohm-cm1.00e+14 ohm-cmASTM D257
Surface Resistance 1.00e+15 ohm1.00e+15 ohmASTM D257
Insulation Resistance >= 2.00e+12 ohm>= 2.00e+12 ohmC/96/60/95; ASTM D257
Dielectric Constant 5.92 - 6.08
@Frequency 1e+10 Hz
5.92 - 6.08
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Dissipation Factor 0.0023
@Frequency 1e+10 Hz
0.0023
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  18.0 µm/m-°C
@Temperature 0.000 - 140 °C
10.0 µin/in-°F
@Temperature 32.0 - 284 °F
X-, Y-Direction; ASTM D3386
 26.0 µm/m-°C
@Temperature 0.000 - 140 °C
14.4 µin/in-°F
@Temperature 32.0 - 284 °F
Z-Direction; ASTM D3386
Specific Heat Capacity 0.780 J/g-°C0.186 BTU/lb-°Fcalculated
Thermal Conductivity 0.720 W/m-K
@Temperature 80.0 °C
5.00 BTU-in/hr-ft²-°F
@Temperature 176 °F
ASTM C518
Decomposition Temperature 425 °C797 °FTGA; ASTM D3850
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant-11 ppm/°CIPC-TM-650 2.5.5.5; -55°C to 125°C

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Chemically Resistant adhesives

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