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Chemically Resistant adhesives

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Rogers Corporation TMM® TMM6 Ceramic Thermoset Polymer Composite
Categories: Polymer; Thermoset

Material Notes: TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.

Features:

  • Wide range of dielectric constants. Ideal for single material systems on a wide variety of applications.
  • Excellent mechanical properties. Resists creep and cold flow.
  • Exceptionally low thermal coefficient of dielectric constant.
  • Coefficient of thermal expansion matched to copper. High reliability of plated through holes.
  • Resistant to process chemicals. No damage to material during fabrication and assembly processes.
  • Thermoset resin for reliable wirebonding. No specialized production techniques required. TMM 10 and 10i laminates can replace alumina substrates.
  • Lead-free process compatible

Typical Applications:

  • RF and Microwave Circuitry
  • Global Positioning Systems Antennas
  • Power Amplifiers and Combiners
  • Patch Antennas
  • Filters and Coupler
  • Dielectric Polarizers and Lenses
  • Satellite Communication Systems
  • Chip Testers

Information provided by Rogers Corporation.

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.37 g/ccASTM D792
Water Absorption 0.060 %
@Thickness 1.27 mm
D/48/50; ASTM D570
 0.20 %
@Thickness 3.17 mm
D/48/50; ASTM D570
Thickness 15.0 - 500 milRange of Standard Thicknesses
 
Mechanical PropertiesOriginal ValueComments
Flexural Strength 104 MPaX, Y direction; Condition A; ASTM D790
Flexural Modulus 12100 MPaX, Y direction; Condition A; ASTM D790
Izod Impact, Notched 0.420 ft-lb/inX, Y direction; ASTM D256A
Peel Strength 5.70 pliX, Y direction; after solder float 1 oz. EDC; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+14 ohm-cmASTM D257
Surface Resistance 1.00e+15 ohmASTM D257
Insulation Resistance >= 2.00e+12 ohmC/96/60/95; ASTM D257
Dielectric Constant 5.92 - 6.08
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Dissipation Factor 0.0023
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 18.0 µm/m-°C
@Temperature 0.000 - 140 °C
X-, Y-Direction; ASTM D3386
 26.0 µm/m-°C
@Temperature 0.000 - 140 °C
Z-Direction; ASTM D3386
Specific Heat Capacity 0.780 J/g-°Ccalculated
Thermal Conductivity 0.720 W/m-K
@Temperature 80.0 °C
ASTM C518
Decomposition Temperature 425 °CTGA; ASTM D3850
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant-11 ppm/°CIPC-TM-650 2.5.5.5; -55°C to 125°C

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Chemically Resistant adhesives

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