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Chemically Resistant adhesives

Devcon Tile Adhesive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Abrasion-Resistant System

Comments: Putty

Data provided by Ellsworth Adhesives.

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Physical PropertiesMetricEnglishComments
Density 1.44 g/cc0.0521 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8181ASTM D2240
Tensile Strength, Ultimate 18.2 MPa2640 psiASTM D638
Tensile Modulus 5.52 GPa800 ksiASTM D638
Flexural Yield Strength 37.8 MPa5480 psiASTM D790
Compressive Yield Strength 59.4 MPa8620 psiASTM D695
Adhesive Bond Strength 19.9 MPa2890 psiAdhesive tensile shear strength; ASTM D1002
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 4646ASTM D150
Dielectric Strength 12.6 kV/mm320 kV/inASTM D149
 
Thermal PropertiesMetricEnglishComments
CTE, linear 25.0 µm/m-°C
@Temperature 20.0 °C
13.9 µin/in-°F
@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.523 W/m-K3.62 BTU-in/hr-ft²-°FASTM C177
Maximum Service Temperature, Air 93.3 °C200 °FOperating Temperature
Shrinkage 0.10 %0.10 %During Cure; ASTM D2566
 
Processing PropertiesMetricEnglishComments
Processing Temperature 21.1 °C70.0 °F
Pot Life 120 - 180 min
@Temperature 23.9 °C
120 - 180 min
@Temperature 75.0 °F
 
Descriptive Properties
Coverage per lb.76.4 in²at 1/4 inch thick
Mix Ratio by Volume1 to 1resin:hardener
Mix Ratio by Weight10 to 9resin:hardener

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PITWX25 / 48512

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