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Elmet Technologies

Park Aerospace Nelcote® V-341 Polybutadiene Prepreg, 503 Quartz Reinforced
Categories: Polymer; Thermoset; Rubber or Thermoset Elastomer (TSE)

Material Notes: Nelcote® V-341 is Polybutadiene resin system designed to provide excellent electrical properties in demanding airborne, shipboard, and undersea applications.

Key Features and Benefits:

  • Extremely low Dk/Df values for demanding RF / microwave applications
  • Self adhesive bond to foam cores
  • Long ambient out-time for easy processing
  • Easily processed in both vacuum/oven and autoclave processes
  • A cost effective, shop-friendly alternative to BMI and Cyanate Ester materials in many applications
  • Resistant to fungus, moisture, rain impact, and most chemicals

Applications/Qualifications:

  • High performance radomes
  • Signature control devices
  • US Army Helicopter
  • Air Force Ground-Based Radar

Information provided by Park Electrochemical Corp.

Key Words: PB
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Volatiles <= 2.0 %
@Temperature 288 °C
<= 2.0 %
@Temperature 550 °F
10 min
Water Absorption 0.050 %0.050 %14 days immersion
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 6767
Tensile Strength, Yield  427 MPa
@Temperature 93.3 °C
62000 psi
@Temperature 200 °F
0° Direction, Dry; ASTM D638
 503 MPa
@Temperature 23.9 °C
73000 psi
@Temperature 75.0 °F
0° Direction, Dry; ASTM D638
Tensile Modulus 20.0 GPa
@Temperature 23.9 °C
2900 ksi
@Temperature 75.0 °F
0° Direction, Dry; ASTM D638
Flexural Strength  172 MPa
@Temperature 93.3 °C
25000 psi
@Temperature 200 °F
Dry; ASTM D790
 193 MPa
@Temperature 93.3 °C
28000 psi
@Temperature 200 °F
Dry; Post-Cure; ASTM D790
 345 MPa
@Temperature 23.9 °C
50000 psi
@Temperature 75.0 °F
Dry; Post-Cure; ASTM D790
 372 MPa
@Temperature 23.9 °C
54000 psi
@Temperature 75.0 °F
Dry; ASTM D790
Flexural Modulus  11.7 GPa
@Temperature 93.3 °C
1700 ksi
@Temperature 200 °F
Dry; Post-Cure; ASTM D790
 15.2 GPa
@Temperature 93.3 °C
2200 ksi
@Temperature 200 °F
Dry; ASTM D790
 18.6 GPa
@Temperature 23.9 °C
2700 ksi
@Temperature 75.0 °F
Dry; Post-Cure; ASTM D790
 20.0 GPa
@Temperature 23.9 °C
2900 ksi
@Temperature 75.0 °F
Dry; ASTM D790
Compressive Strength 152 MPa
@Temperature 93.3 °C
22000 psi
@Temperature 200 °F
Dry; Post-Cure; ASTM D695
Compressive Modulus 20.0 GPa
@Temperature 93.3 °C
2900 ksi
@Temperature 200 °F
Dry; Post-Cure
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant  3.09
@Frequency 1e+10 Hz
3.09
@Frequency 1e+10 Hz
 3.12
@Frequency 3.50e+10 Hz
3.12
@Frequency 3.50e+10 Hz
Dissipation Factor  0.0030
@Frequency 3.50e+10 Hz
0.0030
@Frequency 3.50e+10 Hz
 0.0035
@Frequency 1e+10 Hz
0.0035
@Frequency 1e+10 Hz
 
Processing PropertiesMetricEnglishComments
Gel Time 1.00 - 1.50 min
@Temperature 171 °C
1.00 - 1.50 min
@Temperature 340 °F
Shelf Life  3.00 Month
@Temperature 4.44 °C
3.00 Month
@Temperature 40.0 °F
 6.00 Month
@Temperature -17.8 °C
6.00 Month
@Temperature 0.000 °F
 
Descriptive Properties
Fungus ResistanceRated 1 (Pass)ASTM G21-70
Prepreg Resin Content (%)26-33
Rain Impact ErosionNo detrimental effect at 15 minutes2mm droplet at 1"/hr
Resin Flow (%)6-14350°F, 100psi

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