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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Lucas-Milhaupt SIL-FOS® 5 Silver/ Copper/ Phosphorus Alloy
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes:

Applications: Sil-Fos 5 was developed primarily for use on copper, but their use has extended to other nonferrous copper base alloys. It is used extensively on refrigeration units, air conditioning apparatus, electrical conductors, copper and brass pipe fittings, and other copper and brass equipment.

Characteristics:Sil-Fos 5 is copper rich, filler metals that are self-fluxing on copper by virtue of their phosphorus content. Sil-Fos 5, because of its higher phosphorus content, is more fluid than Sil-Fos 5 when heated rapidly to its flow point. Sil-Fos has less tendency to form large fillets or to fill poorly fitted joints with large clearances cannot be maintained or where fillets are specified.

The self-fluxing of these filler metals is effective on copper only. With copper-base alloys, such as bass or bronze, the joints should be fluxed with Handy-Flux. Sil-Fos 5 should not be used on nickel-base alloys, as the phosphorus reacts with the nickel or iron to form brittle compounds at the interface of the joints.

Both Sil-Fos 5 is mutually soluble with copper and copper alloy base metals.

This metal has a strong tendency to liquate (i.e. to separate into low and high melting constituents) if heated slowly through its melting range, as normally occurs in furnace brazing. The results in leaving a skull of unmelted alloy behind which may objectionable from the standpoint of appearance. In furnace brazing it is preferable to preplace the alloys inside the joint where the skull is not visible.

Specifications:This filler metal conform to the following specifications: AWS A5.8 BCuP-3

Information provided by Lucas-Milhaupt, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 0.294 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 35000 - 40000 psiNickel-Silver butt joint
Tensile Strength, Ultimate 30000 - 35000 psiCopper butt joint
 35000 - 40000 psiBrass butt joint
 11600 psi
@Temperature 427 °C
Brass butt joint
 15800 psi
@Temperature 427 °C
Copper butt joint
 23600 psi
@Temperature 260 °C
Copper butt joint
 28500 psi
@Temperature 260 °C
Brass butt joint
 32050 psi
@Temperature 93.3 °C
Copper butt joint
 34000 psi
@Temperature 93.3 °C
Brass butt joint
Elongation at Break 2.0 - 5.0 %% in 2", Nickel-Silver butt joint
 15 - 20 %% in 2", Copper butt joint
 20 - 25 %% in 2", Brass butt joint
 2.9 %
@Temperature 427 °C
in 2", Brass butt joint
 9.4 %
@Temperature 427 °C
in 2", Copper butt joint
 19.2 %
@Temperature 260 °C
in 2", Brass butt joint
 19.2 %
@Temperature 93.3 °C
in 2", Brass butt joint
 24.5 %
@Temperature 260 °C
in 2", Copper butt joint
 32.8 %
@Temperature 93.3 °C
in 2", Copper butt joint
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000181 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Melting Point 1185 - 1495 °F
Solidus 1185 °FMelting Point
Liquidus 1495 °FFlow Point
 
Processing PropertiesOriginal ValueComments
Processing Temperature 1300 - 1500 °FBrazing Range
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu 88 - 90 %
Other, total <= 0.15 %
Phosphorus, P 5.8 - 6.2 %
Silver, Ag 4.8 - 5.2 %
 
Descriptive Properties
ColorGray

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NLUCMI50 / 18117

solder replacement adhesives

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