MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

Lucas-Milhaupt SIL-FOS® 5 Silver/ Copper/ Phosphorus Alloy
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes:

Applications: Sil-Fos 5 was developed primarily for use on copper, but their use has extended to other nonferrous copper base alloys. It is used extensively on refrigeration units, air conditioning apparatus, electrical conductors, copper and brass pipe fittings, and other copper and brass equipment.

Characteristics:Sil-Fos 5 is copper rich, filler metals that are self-fluxing on copper by virtue of their phosphorus content. Sil-Fos 5, because of its higher phosphorus content, is more fluid than Sil-Fos 5 when heated rapidly to its flow point. Sil-Fos has less tendency to form large fillets or to fill poorly fitted joints with large clearances cannot be maintained or where fillets are specified.

The self-fluxing of these filler metals is effective on copper only. With copper-base alloys, such as bass or bronze, the joints should be fluxed with Handy-Flux. Sil-Fos 5 should not be used on nickel-base alloys, as the phosphorus reacts with the nickel or iron to form brittle compounds at the interface of the joints.

Both Sil-Fos 5 is mutually soluble with copper and copper alloy base metals.

This metal has a strong tendency to liquate (i.e. to separate into low and high melting constituents) if heated slowly through its melting range, as normally occurs in furnace brazing. The results in leaving a skull of unmelted alloy behind which may objectionable from the standpoint of appearance. In furnace brazing it is preferable to preplace the alloys inside the joint where the skull is not visible.

Specifications:This filler metal conform to the following specifications: AWS A5.8 BCuP-3

Information provided by Lucas-Milhaupt, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.14 g/cc0.294 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 241 - 276 MPa35000 - 40000 psiNickel-Silver butt joint
Tensile Strength, Ultimate 207 - 241 MPa30000 - 35000 psiCopper butt joint
 241 - 276 MPa35000 - 40000 psiBrass butt joint
 80.0 MPa
@Temperature 427 °C
11600 psi
@Temperature 800 °F
Brass butt joint
 109 MPa
@Temperature 427 °C
15800 psi
@Temperature 800 °F
Copper butt joint
 163 MPa
@Temperature 260 °C
23600 psi
@Temperature 500 °F
Copper butt joint
 197 MPa
@Temperature 260 °C
28500 psi
@Temperature 500 °F
Brass butt joint
 221.0 MPa
@Temperature 93.3 °C
32050 psi
@Temperature 200 °F
Copper butt joint
 234 MPa
@Temperature 93.3 °C
34000 psi
@Temperature 200 °F
Brass butt joint
Elongation at Break 2.0 - 5.0 %2.0 - 5.0 %% in 2", Nickel-Silver butt joint
 15 - 20 %15 - 20 %% in 2", Copper butt joint
 20 - 25 %20 - 25 %% in 2", Brass butt joint
 2.9 %
@Temperature 427 °C
2.9 %
@Temperature 800 °F
in 2", Brass butt joint
 9.4 %
@Temperature 427 °C
9.4 %
@Temperature 800 °F
in 2", Copper butt joint
 19.2 %
@Temperature 260 °C
19.2 %
@Temperature 500 °F
in 2", Brass butt joint
 19.2 %
@Temperature 93.3 °C
19.2 %
@Temperature 200 °F
in 2", Brass butt joint
 24.5 %
@Temperature 260 °C
24.5 %
@Temperature 500 °F
in 2", Copper butt joint
 32.8 %
@Temperature 93.3 °C
32.8 %
@Temperature 200 °F
in 2", Copper butt joint
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000181 ohm-cm0.0000181 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Melting Point 640.6 - 812.8 °C1185 - 1495 °F
Solidus 640.6 °C1185 °FMelting Point
Liquidus 812.8 °C1495 °FFlow Point
 
Processing PropertiesMetricEnglishComments
Processing Temperature 704 - 816 °C1300 - 1500 °FBrazing Range
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 88 - 90 %88 - 90 %
Other, total <= 0.15 %<= 0.15 %
Phosphorus, P 5.8 - 6.2 %5.8 - 6.2 %
Silver, Ag 4.8 - 5.2 %4.8 - 5.2 %
 
Descriptive Properties
ColorGray

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

NLUCMI50 / 18117

solder replacement adhesives

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.