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Master Bond adhesives

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BCC Products EB 6200 Epoxy Tooling Board
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: EB6200 is a “grain-free” elevated temperature epoxy modeling material known for its superior surface finish, dimensional stability and the ability to maintain tolerances even after being subjected to temperature variations. EB6200 has excellent dimensional stability results from the low coefficient of thermal expansion and high glass transition temperature. Applications: Master Models (Aerospace); Automotive Die Models; Vacuum Forming at Elevated Temperatures; Lay-Up Tools for Medium and High Temperature Curing Prepreg

Information provided by BCC Products, Inc.

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.760 g/ccASTM-D-792-66
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 72ASTM D2240
Tensile Strength, Ultimate 4400 psiASTM D638
Flexural Strength 5150 psiASTM D790
Flexural Modulus 349000 psiASTM-D-790
Compressive Strength 4800 psiASTM D695
Compressive Modulus 342000 psiASTM-D-695
Izod Impact, Notched 0.560 ft-lb/inASTM D256
Izod Impact Unnotched 1.05 ft-lbASTM D256
 
Thermal PropertiesOriginal ValueComments
CTE, linear 21.0 µin/in-°F
Deflection Temperature at 1.8 MPa (264 psi) 300 °FASTM-D-648-56
Glass Transition Temp, Tg >= 325 °FASTM D3418

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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PBCC017 / 107244

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