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Master Bond adhesives

XP Phenolic Laminate
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic
Material Notes: Paper based phenolic provides low cost electrical and mechanical properties. It is widely used for switchboards, panel boards, insulating washers, and intricate punched parts.

Information provided by Aurora Technologies.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.41 g/cc0.0510 lb/in³
Water Absorption 3.3 %3.3 %
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell M 105105
Flexural Strength 193 MPa28000 psi
Shear Strength 103 MPa15000 psi
Izod Impact, Notched 0.427 J/cm0.800 ft-lb/in
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 6.7
@Frequency 1e+6 Hz		6.7
@Frequency 1e+6 Hz
Dielectric Strength 14.8 kV/mm375 kV/in
Dielectric Breakdown 55000 V55000 V
Dissipation Factor 0.096
@Frequency 1e+6 Hz		0.096
@Frequency 1e+6 Hz
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 130 °C266 °FMechanical
 130 °C266 °FElectrical
 
Descriptive Properties
ColorTan/Black/Chocolate

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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