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Master Bond adhesives

Materion Brushform® 290 Beryllium Copper Alloy Strip; TM04 Temper (UNS C17200)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Treatment required for max strength: Mill Hardened
Stress Relaxation-% Stress Remaining after 1000 hrs @ 100°C: 98%
Stress Relaxation after 1000 hrs @ 200°C: 77%
Formability Ratio, 90° Bend, Radius/Thickness (Good Way): 1
Formability Ratio (bad Way): 1
Superficial Hardness: 30N 48-58

Tabulated properties apply to products after age hardening. Information supplied by Brush Wellman.

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Key Words: ASTM B-194
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Physical PropertiesMetricEnglishComments
Density 8.36 g/cc0.302 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell C 28 - 3828 - 38
Hardness, Vickers 285 - 369285 - 369
Tensile Strength, Ultimate >= 960 MPa>= 139000 psi
Tensile Strength, Yield 790 - 940 MPa115000 - 136000 psi
Elongation at Break 9.0 - 25 %9.0 - 25 %
Modulus of Elasticity 131 GPa19000 ksi
Fatigue Strength 300 - 340 MPa
@# of Cycles 1.00e+8
43500 - 49300 psi
@# of Cycles 1.00e+8
Reverse Bending (R=1)
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000660 - 0.0000101 ohm-cm0.00000660 - 0.0000101 ohm-cm17-26% IACS Conductivity
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 - 200 °C
9.44 µin/in-°F
@Temperature 68.0 - 392 °F
Thermal Conductivity 105 W/m-K729 BTU-in/hr-ft²-°F
Melting Point 870 - 980 °C1600 - 1800 °F
Solidus 870 °C1600 °F
Liquidus 980 °C1800 °F
 
Component Elements PropertiesMetricEnglishComments
Beryllium, Be 1.8 - 2.0 %1.8 - 2.0 %
Co + Ni >= 0.20 %>= 0.20 %
Co + Ni + Fe <= 0.60 %<= 0.60 %
Copper, Cu 98 %98 %as balance
Lead, Pb <= 0.020 %<= 0.020 %

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