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Master Bond adhesives

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Materion Beryllium Copper Alloy 25 Strip; H (TD04) Temper (UNS C17200)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Treatment required for max strength: as supplied
Formability Ratio, 90° Bend, Radius/Thickness (Good Way): 1
Formability Ratio (bad Way): 2.9
Superficial Hardness: 30T 79-83

Tabulated properties apply to products after age hardening. Information supplied by Brush Wellman.

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Key Words: ASTM B-194, QQ-C-533
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 8.36 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 96 - 102
Hardness, Vickers 216 - 287
Tensile Strength, Ultimate 680 - 830 MPa
Tensile Strength, Yield 620 - 800 MPa
Elongation at Break 2.0 - 18 %
Modulus of Elasticity 131 GPa
Fatigue Strength 240 - 270 MPa
@# of Cycles 1.00e+8
Reverse Bending (R=1)
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000910 - 0.0000115 ohm-cm15-19% IACS Conductivity
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 - 200 °C
Thermal Conductivity 105 W/m-K
Melting Point 870 - 980 °C
Solidus 870 °C
Liquidus 980 °C
 
Component Elements PropertiesOriginal ValueComments
Beryllium, Be 1.8 - 2.0 %
Co + Ni >= 0.20 %
Co + Ni + Fe <= 0.60 %
Copper, Cu 98 %as balance
Lead, Pb <= 0.020 %

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