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Master Bond adhesives

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Copper Alloy, UNS C18625, TD02 Temper, Rod
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Solution Heat Treated and Cold Worked: 1/2 Hard

Fabrication Properties: Excellent Suitability – Soldering, Brazing, Capacity for Being Cold Worked, Capacity for Being Hot Formed

Typical Uses: Automotive electrical terminals; Connectors, automotive; Heater Cores; Relays; Sensor Bodies; Connectors for High Temperatures; Electrical Conductors; Wire, Electrical

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Physical PropertiesOriginal ValueComments
Density 0.320 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 60
Tensile Strength >= 44.0 ksi
 51.0 ksiTypical
Tensile Strength, Yield >= 39.0 ksi0.2% Offset
 48.0 ksi0.2% Offset, Typical
Elongation at Break >= 25 %
Tensile Modulus 17400 ksi
Modulus of Rigidity 6500 ksi
Poissons Ratio 0.33
Machinability 20 %
Forgeability 80 %
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000200 ohm-cm85% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.0 µin/in-°F
@Temperature 20.0 - 100 °C
Thermal Conductivity 195 BTU-in/hr-ft²-°F
Melting Point 1967 - 1976 °F
Solidus 1967 °F
Liquidus 1976 °F
Annealing Point >= 1110 °F
 
Processing PropertiesOriginal ValueComments
Processing Temperature 570 °FStress Relief
Precipitation Temperature >= 930 °F
 
Component Elements PropertiesOriginal ValueComments
Cobalt, Co 0.15 - 0.35 %
Copper, Cu >= 99.4 %
Nickel, Ni <= 0.10 %
Phosphorus, P 0.050 - 0.090 %
Tin, Sn 0.010 - 0.10 %
Zinc, Zn <= 0.10 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC18625x2 / 291661

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