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Master Bond adhesives

Copper Alloy, UNS C18625, TD02 Temper, Rod
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Solution Heat Treated and Cold Worked: 1/2 Hard

Fabrication Properties: Excellent Suitability – Soldering, Brazing, Capacity for Being Cold Worked, Capacity for Being Hot Formed

Typical Uses: Automotive electrical terminals; Connectors, automotive; Heater Cores; Relays; Sensor Bodies; Connectors for High Temperatures; Electrical Conductors; Wire, Electrical

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Physical PropertiesMetricEnglishComments
Density 8.86 g/cc0.320 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell B 6060
Tensile Strength >= 303 MPa>= 44000 psi
 352 MPa51000 psiTypical
Tensile Strength, Yield >= 269 MPa>= 39000 psi0.2% Offset
 331 MPa48000 psi0.2% Offset, Typical
Elongation at Break >= 25 %>= 25 %
Tensile Modulus 120 GPa17400 ksi
Modulus of Rigidity 44.8 GPa6500 ksi
Poissons Ratio 0.330.33
Machinability 20 %20 %
Forgeability 80 %80 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000200 ohm-cm0.00000200 ohm-cm85% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 18.0 µm/m-°C
@Temperature 20.0 - 100 °C
10.0 µin/in-°F
@Temperature 68.0 - 212 °F
Thermal Conductivity 28.1 W/m-K195 BTU-in/hr-ft²-°F
Melting Point 1075 - 1080 °C1967 - 1976 °F
Solidus 1075 °C1967 °F
Liquidus 1080 °C1976 °F
Annealing Point >= 599 °C>= 1110 °F
 
Processing PropertiesMetricEnglishComments
Processing Temperature 299 °C570 °FStress Relief
Precipitation Temperature >= 499 °C>= 930 °F
 
Component Elements PropertiesMetricEnglishComments
Cobalt, Co 0.15 - 0.35 %0.15 - 0.35 %
Copper, Cu >= 99.4 %>= 99.4 %
Nickel, Ni <= 0.10 %<= 0.10 %
Phosphorus, P 0.050 - 0.090 %0.050 - 0.090 %
Tin, Sn 0.010 - 0.10 %0.010 - 0.10 %
Zinc, Zn <= 0.10 %<= 0.10 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC18625x2 / 291661

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