Rogers Arlon CLTE-AT Commercial Ceramic PTFE

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Rogers Arlon CLTE-AT Commercial Ceramic PTFE
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	Microwave material for improved thermal management, Excellent dimensional stability with high degree of phase stability vs. temperature. CLTE-AT is a micro-dispersed ceramic PTFE composite utilizing a woven fiberglass reinforcement to provide the highest degree of stability, critical in multi-layer designs. Ceramic/PTFE microwave composite Mechanically more robust and more dimensionally stable than alternatives High thermal conductivity Lowest Insertion Loss in commercial class Very low Loss Tangent (0.0013) Tight Dielectric constant and Thickness tolerance Electrical phase stability vs. temperature Benefits: Excellent thermal stability of Dk and Df Phase stability across temperature High degree of Dimensional stability required for complex, multi-layer boards Excellent CTE in X, Y and Z Typical Applications: Automotive Radar & Adaptive Cruise Control Applications Microwave/RF Applications Phase/Temperature Sensitive Antennas Phase Sensitive Electronic Applications RF and Microwave Filters Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors:	Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Metric	English	Comments

Density	2.06 g/cc	0.0744 lb/in³	ASTM D792 Method A
Water Absorption	0.030 %	0.030 %	IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss	0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F	Water Vapor Recovered; NASA SP-R-0022A
	0.040 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.040 % @Pressure <=1.93e-8 psi, Temperature 257 °F	NASA SP-R-0022A
Collected Volatile Condensable Material	0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F	NASA SP-R-0022A

Mechanical Properties	Metric	English	Comments
Tensile Strength	30.3 MPa	4400 psi	Cross; IPC TM-650 2.4.18.3
	48.3 MPa	7000 psi	Machine; IPC TM-650 2.4.18.3
Modulus of Elasticity	1.79 GPa	260 ksi	IPC TM-650 2.4.18.3
Flexural Strength	53.8 MPa	7800 psi	Cross; IPC TM-650 2.4.4
	101 MPa	14600 psi	Machine; IPC TM-650 2.4.4
Compressive Modulus	1.68 GPa	244 ksi	ASTM D3410
Poissons Ratio	0.17	0.17	ASTM D3039
Shear Modulus	0.760 GPa	110 ksi	Calculated
Peel Strength	1.23 kN/m	7.00 pli	To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
	1.23 kN/m	7.00 pli	To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
	1.58 kN/m	9.00 pli	To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2

Electrical Properties	Metric	English	Comments
Volume Resistivity	4.25e+14 ohm-cm	4.25e+14 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	2.02e+14 ohm	2.02e+14 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	3.0 @Frequency 1e+10 Hz	3.0 @Frequency 1e+10 Hz	IPC TM-650 2.5.5.3
Dielectric Breakdown	58000 V	58000 V	IPC TM-650 2.5.6
Dissipation Factor	0.00125 @Temperature -20.0 °C	0.00125 @Temperature -4.00 °F
	0.014 @Temperature 120 °C	0.014 @Temperature 248 °F
	0.0013 @Frequency 1e+6 Hz	0.0013 @Frequency 1e+6 Hz	IPC TM-650 2.5.5.3
	0.0013 @Frequency 1e+10 Hz	0.0013 @Frequency 1e+10 Hz	IPC TM-650 2.5.5.5
Arc Resistance	250 sec	250 sec	IPC TM-650 2.5.1

Thermal Properties	Metric	English	Comments
CTE, linear	8.00 µm/m-°C @Temperature 50.0 - 150 °C	4.44 µin/in-°F @Temperature 122 - 302 °F	IPC TM-650 2.4.41
CTE, linear, Transverse to Flow	20.0 µm/m-°C @Temperature 50.0 - 150 °C	11.1 µin/in-°F @Temperature 122 - 302 °F	z direction; IPC TM-650 2.4.24
Thermal Conductivity	0.640 W/m-K	4.44 BTU-in/hr-ft²-°F	ASTM E1461
Decomposition Temperature	487 °C	909 °F	Onset; IPC TM-650 2.4.24.6
	529 °C	984 °F	5 percent; IPC TM-650 2.4.24.6
Flammability, UL94	V-0	V-0

Descriptive Properties
IPC Delamination - T260 (minutes)	> 60		IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)	> 60		IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)	> 60		IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)	-10		IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)

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