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Elmet Technologies

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Rogers Arlon CLTE-AT Commercial Ceramic PTFE
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)

Material Notes: Microwave material for improved thermal management, Excellent dimensional stability with high degree of phase stability vs. temperature.

CLTE-AT is a micro-dispersed ceramic PTFE composite utilizing a woven fiberglass reinforcement to provide the highest degree of stability, critical in multi-layer designs.

  • Ceramic/PTFE microwave composite
  • Mechanically more robust and more dimensionally stable than alternatives
  • High thermal conductivity
  • Lowest Insertion Loss in commercial class
  • Very low Loss Tangent (0.0013)
  • Tight Dielectric constant and Thickness tolerance
  • Electrical phase stability vs. temperature

Benefits:

  • Excellent thermal stability of Dk and Df
  • Phase stability across temperature
  • High degree of Dimensional stability required for complex, multi-layer boards
  • Excellent CTE in X, Y and Z

Typical Applications:

  • Automotive Radar & Adaptive Cruise Control Applications
  • Microwave/RF Applications
  • Phase/Temperature Sensitive Antennas
  • Phase Sensitive Electronic Applications
  • RF and Microwave Filters

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.

Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesOriginal ValueComments
Density 2.06 g/ccASTM D792 Method A
Water Absorption 0.030 %IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
Water Vapor Recovered; NASA SP-R-0022A
 0.040 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
NASA SP-R-0022A
Collected Volatile Condensable Material 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
NASA SP-R-0022A
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 4400 psiCross; IPC TM-650 2.4.18.3
 7000 psiMachine; IPC TM-650 2.4.18.3
Modulus of Elasticity 260 ksiIPC TM-650 2.4.18.3
Flexural Strength 7.80 ksiCross; IPC TM-650 2.4.4
 14.6 ksiMachine; IPC TM-650 2.4.4
Compressive Modulus 244 ksiASTM D3410
Poissons Ratio 0.17ASTM D3039
Shear Modulus 0.760 GPaCalculated
Peel Strength 7.00 pliTo Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
 7.00 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 9.00 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.25e+14 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 2.02e+14 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 3.0
@Frequency 1e+10 Hz
IPC TM-650 2.5.5.3
Dielectric Breakdown 58000 VIPC TM-650 2.5.6
Dissipation Factor 0.00125
@Temperature -20.0 °C
 0.014
@Temperature 120 °C
 0.0013
@Frequency 1e+6 Hz
IPC TM-650 2.5.5.3
 0.0013
@Frequency 1e+10 Hz
IPC TM-650 2.5.5.5
Arc Resistance 250 secIPC TM-650 2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 8.00 µm/m-°C
@Temperature 50.0 - 150 °C
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 20.0 µm/m-°C
@Temperature 50.0 - 150 °C
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.640 W/m-KASTM E1461
Decomposition Temperature 487 °COnset; IPC TM-650 2.4.24.6
 529 °C5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-10IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)

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