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Master Bond adhesives

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Devcon Backing Compound Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Abrasion-Resistant System

Data provided by Ellsworth Adhesives.

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Physical PropertiesOriginal ValueComments
Density 0.0581 lb/in³
Viscosity 4700 cPwith hardener
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 92ASTM D2240
Tensile Strength, Ultimate 5497 psiASTM D638
Tensile Modulus 920 ksiASTM D638
Flexural Yield Strength 8558 psiASTM D790
Compressive Yield Strength 13880 psiASTM D695
Adhesive Bond Strength 2000 psiAdhesive tensile shear strength; ASTM D1002
 
Thermal PropertiesOriginal ValueComments
CTE, linear 40.0 µm/m-°C
@Temperature 20.0 °C
ASTM D696
Maximum Service Temperature, Air 250 °FOperating Temperature
Shrinkage 0.10 %During Cure; ASTM D2566
 
Processing PropertiesOriginal ValueComments
Processing Temperature 70.0 °F
Pot Life 15.0 min
@Temperature 23.9 °C
 
Descriptive Properties
Coverage per 20.3 lb.347 in²
Mix Ratio by Volume9 to 1resin:hardener
Mix Ratio by Weight100 to 6.84resin:hardener

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PITWX23 / 48510

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