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Master Bond adhesives

Devcon Backing Compound Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Abrasion-Resistant System

Data provided by Ellsworth Adhesives.

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Physical PropertiesMetricEnglishComments
Density 1.61 g/cc0.0581 lb/in³
Viscosity 4700 cP4700 cPwith hardener
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 9292ASTM D2240
Tensile Strength, Ultimate 37.90 MPa5497 psiASTM D638
Tensile Modulus 6.34 GPa920 ksiASTM D638
Flexural Yield Strength 59.01 MPa8558 psiASTM D790
Compressive Yield Strength 95.70 MPa13880 psiASTM D695
Adhesive Bond Strength 13.8 MPa2000 psiAdhesive tensile shear strength; ASTM D1002
 
Thermal PropertiesMetricEnglishComments
CTE, linear 40.0 µm/m-°C
@Temperature 20.0 °C
22.2 µin/in-°F
@Temperature 68.0 °F
ASTM D696
Maximum Service Temperature, Air 121 °C250 °FOperating Temperature
Shrinkage 0.10 %0.10 %During Cure; ASTM D2566
 
Processing PropertiesMetricEnglishComments
Processing Temperature 21.1 °C70.0 °F
Pot Life 15.0 min
@Temperature 23.9 °C
15.0 min
@Temperature 75.0 °F
 
Descriptive Properties
Coverage per 20.3 lb.347 in²
Mix Ratio by Volume9 to 1resin:hardener
Mix Ratio by Weight100 to 6.84resin:hardener

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PITWX23 / 48510

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