Product Highlights: - Superior thermal conductivity
- Excellent flow properties
- First-rate flexibility
- Very low exotherm, ideal for casting
- Exceptional electrical insulation properties
- Resists mechanical and thermal shocks
Kohesi Bond KB 1048 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This epoxy system offers excellent flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1048 FLAO is thermally conductive and offers top notch heat transfer properties. It offers an extensive service temperature range of -73°C to +120°C. This adhesive fosters outstanding resistance to mechanical and thermal shocks. It is a 100% solids system, offering minimal shrinkage upon cure. KB 1048 FLAO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part A and Part B are light gray in color. KB 1048 FLAO is widely used in optoelectronic, electronics, automotive, space and related industries especially where thermal conductivity and high flexibility are desired. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
