Henkel Loctite® ABLESTIK 84-1LMISR4 Epoxy

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Henkel Loctite® ABLESTIK 84-1LMISR4 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Product Benefits: Conductive Box oven cure Excellent dispensability, minimal tailing and stringing Cure: Heat cure Application: Die attach LOCTITE ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.600 % @Temperature 85.0 °C	Cured @ Saturation, after 85% RH exposure
pH	6.0
Brookfield Viscosity	8000 cP	Uncured, CP51, Speed 10 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	300 MPa @Temperature 250 °C	Cured
	2000 MPa @Temperature 150 °C	Cured
	3900 MPa @Temperature 25.0 °C	Cured
	4400 MPa @Temperature -65.0 °C	Cured
Shear Strength	7.00 MPa	Lap

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.00020 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	40.0 µm/m-°C	Cured, Below Tg
	150 µm/m-°C	Cured, Above Tg
Thermal Conductivity	2.50 W/m-K @Temperature 121 °C	Cured
Glass Transition Temp, Tg	120 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	3.00 - 5.00 min	minute ramp to 175°C + 1 hour @ 175°C, Alternate Cure Schedule
	1.00 hour @Temperature 175 °C
Working Life	18.0 hour
Shelf Life	12.0 Month @Temperature 5.00 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
	<20	Cured, Chloride (Cl-)
Shear Strength	>2.8 kg	@ 150°C, 2 X 2 mm (80 x 80 mil) Si die on Ag/Cu LF
	>8 kg	@ 25°C, 2 X 2 mm (80 x 80 mil) Si die on Ag/Cu LF
	1.4 kg-f/die	On Bare Cu LF @ 250°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	1.7 kg-f/die	On Ag/Cu LF @ 250°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	1.8 kg-f/die	On Ag/Cu LF @ 200°C, After 85ºC/85% RH exposure for 168 hours
	1.8 kg-f/die	On Pd/Ni/Cu LF @ 200°C, After 85ºC/85% RH exposure for 168 hours
	10 kg-f/die	On Bare Cu LF @ 25°C, After 85ºC/85% RH exposure for 168 hours
	11 kg-f/die	On Bare Cu LF @ 25°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	12 kg-f/die	On Ag/Cu LF @ 25°C, After 85ºC/85% RH exposure for 168 hours
	2 kg-f/die	On Pd/Ni/Cu LF @ 250°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	2.4 kg-f/die	On Pd/Ni/Cu LF @ 200°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	2.5 kg-f/die	On Bare Cu LF @ 200°C, After 85ºC/85% RH exposure for 168 hours
	2.6 kg-f/die	On Bare Cu LF @ 200°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	2.9 kg-f/die	On Ag/Cu LF @ 200°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	21 kg-f/die	On Ag/Cu LF @ 25°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
	23 kg-f/die	On Pd/Ni/Cu LF @ 25°C, After 85ºC/85% RH exposure for 168 hours
	27 kg-f/die	On Pd/Ni/Cu LF @ 25°C, Post Cure, 3 X 3 mm (120 x 120 mil) Si die
Thixotropic Index	5.6	Uncured, 0.5/5 rpm
Water Extract Conductivity	<2 µmhos/cm	Cured
Weight Loss (%)	0.35	Cured @ 300ºC, TGA

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PLOCT5005 / 255216

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