Features and Benefits:- Low dielectric loss
- Excellent mechanical properties versus temperature - reliable stripline and multi-layer board constructions.
- Uniform mechanical properties- ideal for multi-layer board designs with a range of dielectric constants and suitable for use with epoxy glass multi-layer board hybrid designs.
- Low in-plane expansion coefficient (match to copper) - allows for more reliable surface mounted assemblies, ideal for applications sensitive to temperature change and excellent dimensional stability
- Stable dielectric constant versus temperature and frequency - Ideal for band pass filters, microstrip patch antennas and voltage controlled oscillators
- High thermal conductivity - Lower operating temperature and increased reliability in power amplifier applications
- Lead-free process compatible
Uses: - Commercial microwave applications
- RF applications
Information provided by Rogers Corporation. |
