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Master Bond adhesives

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Palladium, CP Grade, Cold-Drawn Deoxidized, Annealed at 500°C
Categories: Metal; Nonferrous Metal; Precious Metal; Palladium Alloy; Pure Element

Key Words: Palladium, Pd
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Physical PropertiesOriginal ValueComments
Density 12.02 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Brinell 105Estimated from Vickers
Hardness, Knoop 120Estimated from Vickers
Hardness, Rockwell B 57Estimated from Vickers
Hardness, Vickers 105
Tensile Strength, Ultimate 295 MPa
Elongation at Break 5.0 %
Tensile Modulus 112 GPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000108 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Heat of Fusion 17.6 J/g
CTE, linear 11.76 µm/m-°C
@Temperature 20.0 °C
 12.2 µm/m-°C
@Temperature 20.0 - 250 °C
 12.8 µm/m-°C
@Temperature 20.0 - 500 °C
 13.9 µm/m-°C
@Temperature 20.0 - 1000 °C
Specific Heat Capacity 0.245 J/g-°C
Thermal Conductivity 76.0 W/m-K
Melting Point 1552 °C
 
Optical PropertiesOriginal ValueComments
Emissivity (0-1) 0.3365 micron
Reflection Coefficient, Visible (0-1) 0.63White light
 
Component Elements PropertiesOriginal ValueComments
Palladium, Pd 99.85 %

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