| Developed for RoHS-compliant electronics. The addition of indium to traditional AuSn 80/20 raises its melting point from 278°C to 306°C, providing protection against secondary reflow, loss of hermeticity, or critical component shift during the SMT soldering process. AuSn Plus has comparable physical properties to AuSn and slightly higher processing temperatures near 350°C, similar to those of high-lead solders. The inclusion of indium in the alloy does not affect the AuSn intermetallic formation; the indium substitutes for some of the tin in the Au4Sn intermetallic compound. This ternary alloy is slightly harder and less ductile than traditional AuSn alloy.Information supplied by Materion. |
