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Master Bond adhesives

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Copper Alloy, UNS C40850, H01 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 1/4 Hard

Fabrication Properties: Excellent Suitability – Soldering, Brazing, Capacity for Being Cold Worked; Good Suitability – Oxyacetylene Welding, Gas Shielded Arc Welding, Butt Weld; Fair Suitability – Capacity for Being Hot Formed

Typical Uses: Terminals, automotive; Connectors, electronic; Contact springs; Lead Frames

Applicable Specifications: Bar – ASTM B591; Strip – ASTM B888/B88M, ASTM B591

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Physical PropertiesOriginal ValueComments
Density 0.320 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 60.0 ksi
Tensile Strength, Yield 42.0 ksi0.2% Offset
Elongation at Break 24 %
Tensile Modulus 17000 ksi
Modulus of Rigidity 6000 ksi
Poissons Ratio 0.42Calculated
Machinability 20 %
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000570 ohm-cm30% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.1 µin/in-°F
@Temperature 20.0 - 300 °C
Thermal Conductivity 75.0 BTU-in/hr-ft²-°F
Melting Point 1890 - 1940 °F
Solidus 1890 °F
Liquidus 1940 °F
Annealing Point 660 - 1350 °F
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu 94.5 - 96.5 %
Iron, Fe 0.050 - 0.20 %
Lead, Pb <= 0.050 %
Nickel, Ni 0.050 - 0.20 %
Phosphorus, P 0.010 - 0.20 %
Tin, Sn 2.6 - 4.0 %
Zinc, Zn <= 2.8 %As Balance
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC40850x2 / 291889

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