Copper Alloy, UNS C40850, H01 Temper, Flat Products

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Copper Alloy, UNS C40850, H01 Temper, Flat Products
Categories:	Metal; Nonferrous Metal; Copper Alloy
Material Notes:	Temper: 1/4 Hard Fabrication Properties: Excellent Suitability – Soldering, Brazing, Capacity for Being Cold Worked; Good Suitability – Oxyacetylene Welding, Gas Shielded Arc Welding, Butt Weld; Fair Suitability – Capacity for Being Hot Formed Typical Uses: Terminals, automotive; Connectors, electronic; Contact springs; Lead Frames Applicable Specifications: Bar – ASTM B591; Strip – ASTM B888/B88M, ASTM B591
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Physical Properties	Metric	English	Comments

Density	8.86 g/cc	0.320 lb/in³

Mechanical Properties	Metric	English	Comments
Tensile Strength	414 MPa	60000 psi
Tensile Strength, Yield	290 MPa	42000 psi	0.2% Offset
Elongation at Break	24 %	24 %
Tensile Modulus	117 GPa	17000 ksi
Modulus of Rigidity	41.4 GPa	6000 ksi
Poissons Ratio	0.42	0.42	Calculated
Machinability	20 %	20 %

Electrical Properties	Metric	English	Comments
Electrical Resistivity	0.00000570 ohm-cm	0.00000570 ohm-cm	30% IACS

Thermal Properties	Metric	English	Comments
CTE, linear	18.2 µm/m-°C @Temperature 20.0 - 300 °C	10.1 µin/in-°F @Temperature 68.0 - 572 °F
Thermal Conductivity	10.8 W/m-K	75.0 BTU-in/hr-ft²-°F
Melting Point	1030 - 1060 °C	1890 - 1940 °F
Solidus	1030 °C	1890 °F
Liquidus	1060 °C	1940 °F
Annealing Point	349 - 732 °C	660 - 1350 °F

Component Elements Properties	Metric	English	Comments
Copper, Cu	94.5 - 96.5 %	94.5 - 96.5 %
Iron, Fe	0.050 - 0.20 %	0.050 - 0.20 %
Lead, Pb	<= 0.050 %	<= 0.050 %
Nickel, Ni	0.050 - 0.20 %	0.050 - 0.20 %
Phosphorus, P	0.010 - 0.20 %	0.010 - 0.20 %
Tin, Sn	2.6 - 4.0 %	2.6 - 4.0 %
Zinc, Zn	<= 2.8 %	<= 2.8 %	As Balance

Descriptive Properties
US EPA Registered Antimicrobial	Yes

References for this datasheet.

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MC40850x2 / 291889

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