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Master Bond adhesives

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Fire-refined Tough Pitch Copper, UNS C12500, H03 Temper, Flat
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 3/4 Hard

Fabrication Properties: Excellent Suitability – Soldering, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Brazing, Butt Weld; Fair Suitability – Gas Shielded Arc Welding

Common Fabrication Processes: Blanking, Coining, Coppersmithing, Drawing, Etching, Forming and Bending, Heading and Upsetting, Hot Forging and Pressing, Piercing and Punching, Roll Threading and Knurling, Shearing, Spinning, Squeezing and Swaging, Stamping

Typical uses: Building Fronts; Downspouts; Flashing; Gutters; Roofing; Screening; Spouting; Gaskets; Radiators; Bus Bars; Commutator Segments; Contacts; Radio Parts; Switches; Terminals; Anodes; Chemical Process Equipment; Kettles; Pans; Printing Rolls; Road Bed Expansion Plates; Rotating Bands; Vats

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Physical PropertiesOriginal ValueComments
Density 0.323 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 48.0 ksi
@Thickness 0.508 mm
Tensile Strength, Yield 45.0 ksi
@Thickness 0.508 mm
0.2% Offset
Elongation at Break 6.0 %
@Thickness 0.508 mm
Tensile Modulus 17400 ksi
Modulus of Rigidity 6400 ksi
Poissons Ratio 0.36Calculated
Machinability 20 %
Forgeability 65 %
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000187 ohm-cm92% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 9.30 µin/in-°F
@Temperature 20.0 - 100 °C
 9.60 µin/in-°F
@Temperature 20.0 - 200 °C
 9.80 µin/in-°F
@Temperature 20.0 - 300 °C
Specific Heat Capacity 0.0920 BTU/lb-°F
Thermal Conductivity 202 BTU-in/hr-ft²-°F
Melting Point 1949 - 1981 °F
Solidus 1949 °F
Liquidus 1981 °F
Annealing Point 750 - 1200 °F
 
Processing PropertiesOriginal ValueComments
Hot-Working Temperature 1400 - 1600 °F
 
Component Elements PropertiesOriginal ValueComments
Antimony, Sb <= 0.0030 %
Arsenic, As <= 0.012 %
Bismuth, Bi <= 0.0030 %
Copper, Cu >= 99.88 %
Nickel, Ni <= 0.050 %
Tellurium, Te <= 0.025 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC12500x2 / 292754

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