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Master Bond adhesives

Fire-refined Tough Pitch Copper, UNS C12500, H03 Temper, Flat
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 3/4 Hard

Fabrication Properties: Excellent Suitability – Soldering, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Brazing, Butt Weld; Fair Suitability – Gas Shielded Arc Welding

Common Fabrication Processes: Blanking, Coining, Coppersmithing, Drawing, Etching, Forming and Bending, Heading and Upsetting, Hot Forging and Pressing, Piercing and Punching, Roll Threading and Knurling, Shearing, Spinning, Squeezing and Swaging, Stamping

Typical uses: Building Fronts; Downspouts; Flashing; Gutters; Roofing; Screening; Spouting; Gaskets; Radiators; Bus Bars; Commutator Segments; Contacts; Radio Parts; Switches; Terminals; Anodes; Chemical Process Equipment; Kettles; Pans; Printing Rolls; Road Bed Expansion Plates; Rotating Bands; Vats

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Physical PropertiesMetricEnglishComments
Density 8.94 g/cc0.323 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 331 MPa
@Thickness 0.508 mm
48000 psi
@Thickness 0.0200 in
Tensile Strength, Yield 310 MPa
@Thickness 0.508 mm
45000 psi
@Thickness 0.0200 in
0.2% Offset
Elongation at Break 6.0 %
@Thickness 0.508 mm
6.0 %
@Thickness 0.0200 in
Tensile Modulus 120 GPa17400 ksi
Modulus of Rigidity 44.1 GPa6400 ksi
Poissons Ratio 0.360.36Calculated
Machinability 20 %20 %
Forgeability 65 %65 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000187 ohm-cm0.00000187 ohm-cm92% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.7 µm/m-°C
@Temperature 20.0 - 100 °C
9.30 µin/in-°F
@Temperature 68.0 - 212 °F
 17.3 µm/m-°C
@Temperature 20.0 - 200 °C
9.60 µin/in-°F
@Temperature 68.0 - 392 °F
 17.6 µm/m-°C
@Temperature 20.0 - 300 °C
9.80 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.385 J/g-°C0.0920 BTU/lb-°F
Thermal Conductivity 29.1 W/m-K202 BTU-in/hr-ft²-°F
Melting Point 1065 - 1083 °C1949 - 1981 °F
Solidus 1065 °C1949 °F
Liquidus 1083 °C1981 °F
Annealing Point 399 - 649 °C750 - 1200 °F
 
Processing PropertiesMetricEnglishComments
Hot-Working Temperature 760 - 871 °C1400 - 1600 °F
 
Component Elements PropertiesMetricEnglishComments
Antimony, Sb <= 0.0030 %<= 0.0030 %
Arsenic, As <= 0.012 %<= 0.012 %
Bismuth, Bi <= 0.0030 %<= 0.0030 %
Copper, Cu >= 99.88 %>= 99.88 %
Nickel, Ni <= 0.050 %<= 0.050 %
Tellurium, Te <= 0.025 %<= 0.025 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

MC12500x2 / 292754

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