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Master Bond adhesives

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Bakelite® PF 7596 Phenolic Molding Compound
Categories: Polymer; Thermoset; Phenolic

Material Notes: Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties (Not suitable for use of higher voltage).

Applications: modified with graphite, good heat conductivity, good sliding properties, high dimension stability, fuel pump impellers, bearing parts

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Physical PropertiesOriginal ValueComments
Density 1.63 g/ccISO 1183
Apparent Bulk Density 0.730 g/ccISO 60
Linear Mold Shrinkage 0.0030 cm/cmInjection Molding. Post Shrinkage = 0.1%.; ISO 2577
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 60.0 MPaISO 527 - 1/2
Tensile Modulus 16000 MPaISO 527 - 1/2
Flexural Strength 105 MPaISO 178
Flexural Modulus 14500 MPaISO 178
Compressive Strength 130 MPaISO 604
Charpy Impact Unnotched 5.00 kJ/m²ISO 179-1 eU
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 8.0 MPa 175 °CISO 75-2
 
Descriptive Properties
Water absorption (mg)824h / 23°C

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PBAKE991 / 192353

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