Materion Wambraze™ WB1121 Solder

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Materion Wambraze™ WB1121 Solder
Categories:	Metal; Nonferrous Metal; Precious Metal; Gold Alloy; Solder/Braze Alloy
Material Notes:	High-purity vacuum cast materials are manufactured by Williams in a variety of solder alloys, including gold brazing alloys for electronic packaging and high temperature joining vacuum electronic devices. All Williams solder alloys and gold brazing alloys are available in a variety of shapes and forms, including ribbon, preform, rod, ring, wire, and custom shapes. Powders are available in select WAMBRAZE™ alloys. Trace Impurities for Brazing Alloys: C: 50 ppm max P and Pb: 20 ppm max Ca, Cd, Cs, Li, Mg, Na, Rb, S, Sb, Se, Sr, Te, Ti, Zn: each 10 ppm max Total 100 ppm max Hg: None detected Information provided by Williams Advanced Alloys Former product of Williams Advanced Alloys. Williams Advanced Alloys is now a part of Materion.
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Physical Properties	Original Value	Comments

Density	13.38 g/cc

Mechanical Properties	Original Value	Comments
Tensile Strength	124000 psi
Tensile Strength, Yield	104000 psi
Elongation at Break	23.7 %

Electrical Properties	Original Value	Comments
Electrical Resistivity	0.0000374 ohm-cm	4.6% IACS

Thermal Properties	Original Value	Comments
CTE, linear	15.5 µm/m-°C @Temperature 20.0 - 600 °C
Thermal Conductivity	29.0 W/m-K
Melting Point	1102 - 1121 °C
Solidus	1102 °C
Liquidus	1121 °C

Component Elements Properties	Original Value	Comments
Gold, Au	50 %
Nickel, Ni	25 %
Palladium, Pd	25 %

Descriptive Properties
AWS/AMS Numbers	AMS 4784; AWS BVAu-7
Compare To:	Palniro 1

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NWILL03 / 19891

RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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